With FlipChip platform technology, LUXEON UV FC Line contains both 1mm2 and 2mm2 die sizes and is the smallest and highest power density (W/cm2) ultraviolet with FlipChip Technology in a Chip Scale Package (CSP) LED that can be reflowed onto a substrate with standard surface mount (SMT) equipment and process. Micro sized CSP: 1.0mm2 and 2.0mm2 package for design flexibility and packing density.