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Chip On Board LED Assemblies
Higher Intensity & Greater Uniformity
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The Chip-on-Board LED assembly enables mounting of a bare LED chip directly on the substrate in order to produce LED arrays. It is a method of LED packaging that not only takes less space in a circuit, but also offers higher intensity and greater uniformity when compared to surface mount LED assemblies. If your application needs a quality Chip-on-Board IC, Future Electronics is the right place.

Manufacturer Name: Future Lighting (9)
Location: Pointe Claire, Québec, Canada, United States
Description: Lighting Solutions Developer
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