Chip On Board LED Assemblies
Higher Intensity & Greater Uniformity
The Chip-on-Board LED assembly enables mounting of a bare LED chip directly on the substrate in order to produce LED arrays. It is a method of LED packaging that not only takes less space in a circuit, but also offers higher intensity and greater uniformity when compared to surface mount LED assemblies. If your application needs a quality Chip-on-Board IC, Future Electronics is the right place.
Manufacturer Name:
Future Lighting (9)
Location:
Pointe Claire, Québec, Canada, United States
Description:
Lighting Solutions Developer
Link to Website:
http://www.futurelightingsolutions.com
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